Dear Adnan: The problem you met is mostly the plating underneath the resist at the bottom of the opening. So after you strip resist you will see unexpected deposit. This is caused by poor adhesion of resist and metal(seed layer). So plating solution goes into the interface of resist and metal. One or more of the followings is possible root cause: 1. pH of cyanide solution. High pH solution will attack the resist., reduce the adhesion. So use the gold solution with pH of ~6. 2. Photo process, The steps which effect adhesion,such as, dehydration etc, 3. seed layer contamination. I did above analysis basing on your limited information and my experience. If you have more detailed information, such as thickness & location of unexpected deposit, the issue can more easily be addressed. Eddy Message: 1 To: mems-talk@memsnet.org From: "Adnan Merhaba"Date: Wed, 26 Sep 2001 13:33:40 -0400 Subject: [mems-talk] gold electroplating Hello, My name is Adnan Merhaba and I am a process engineer with the American technical ceramics. I have a question regarding pattern plating of gold, we are currently using a cyanide bath and use 1818 photoresist to mask the areas not to be plated, however during the plating process, we often find that the resist shrinks, and hence plating occurs in region where it is not supposed to. Does anyone know the root cause of this and what are the possible solutions to avoid it? Thank you Regards, Adnan