>  Qun Li:
>
> We are currently working on dry etching processes for thin film PZT on
> platinum electrode structures specifically for MEMS applications.  We
> have had limited success with chlorine and chloroform.  Etch rates are
> relatively slow, about 200-300 angstroms/min.  We are currently
> investigating the use of HCFC-123 which should have improved etch rates

> and selectivity.
>
> Very dilute HF (<0.1%)  or HNO3 is a wet chemical alternative.
>
> As for adhesion, we are using a sol-gel method of deposition.  We
deposit
> on a platinum electrode structure which has been stress relieved.
> If you would like more information, please contact me at my address
> below.
>
> Mary Hendrickson
> __________________________________________________
>       Mary A. Hendrickson
>       Army Research Laboratory
>       Physical Sciences Directorate
>       Advanced Micro Devices Branch
>       Attn:  AMSRL-PS-DA
>       Ft. Monmouth, N.J. 07703-5601
>
>       Phone:     (908) 427-4978
>       FAX:       (908) 427-4978
>       Internet: mhendric@ftmon.arl.mil
> __________________________________________________
>
>
>
>  Dear members:
>
>  We are trying to make an ultrasonic transducer using PZT as the
>  piezoelectric material. If anyone happens to know the etching
techniques
>
>  of PZT as well as the adhesion techniques of PZT to Si substrate,
please
>
>  give some suggestion. Any resource of publications on these issues is
> also
>  urgently needed.
>
>  Thank you very much.
>
>  Yours sincerely,
>
>  Qun LI
>  Dept. of Biomedical Engineering
>  Louisiana Tech University
>  Ruston, LA 71272
>
>
>
>
>
>
>