Dear MEMS colleagues: I'm currently involved in a MEMS contact pressure sensor project. Now the sensor is still at the wafer level and I need to subdice the wafer. Usually water was used to cool the dicing blade, but I'm afraid the water flush may damage the micromachined structure. Anyone can give me suggestions? After subdicing, wire bonding is required for sensor packaging. Because it's a contact sensor, I must make sure that the wire won't break under external pressure. How to solve this problem? Any suggestion is highly appreciated. Best regards, Ebin Find a job, post your resume. http://careers.yahoo.com