durusmail: mems-talk: FPW devices
FPW devices
2001-11-19
FPW devices
Biao Li
2001-11-19
Bottom Pt electrode is necessary since it is difficult to deposit quality
PZT thin film directly on Si without interdiffusion. In general, PZT will be
recrystallized at T>600oC.

-----Original Message-----
From: Rajsekhar Popuri
To: mems-talk@memsnet.org
Sent: 11/18/2001 10:21 AM
Subject: [mems-talk] FPW devices

Hello,

I am trying to work on FPW devices.I couldn`t understand the logic of
having
bottom and top electrodes for the PZT film. Typically,the PZT thin films
are
less than a micron.So i guess the top IDT electrodes will be sufficient
the
drive the membrane in the FPW device.

Can anyone explain me the logic.Any type of help on FPW`s is
appreciated.

Thanks
Rajsekhar.


>From: mems-talk-request@memsnet.org
>Reply-To: mems-talk@memsnet.org
>To: mems-talk@memsnet.org
>Subject: mems-talk digest, Vol 1 #97 - 2 msgs
>Date: Sat, 17 Nov 2001 12:01:09 -0500
>
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>Today's Topics:
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>    1. RE: Help: MEMS packaging (Luesebrink Helge)
>    2. Re: Deep RIE Wafer Mounting to Handle Question (Erik Jung)
>
>--__--__--
>
>Message: 1
>From: Luesebrink Helge 
>To: Yuqi Jiang , mems-talk@memsnet.org
>Subject: RE: [mems-talk] Help: MEMS packaging
>Date: Fri, 16 Nov 2001 11:55:08 -0500
>
>Hi,
>
>Check out this Web Site. You can browse and request papers  there
>
>http://www.evgroup.com/papers/papers.htm
>
>
>Best regards,
>Helge
>
>
>
>
>               -----Original Message-----
>               From:   Yuqi Jiang [mailto:yqjiang55@yahoo.com]
>               Sent:   Friday, November 16, 2001 7:27 AM
>               To:     mems-talk@memsnet.org
>               Subject:        [mems-talk] Help: MEMS packaging
>
>               Hello,
>
>               I am a student and beginer in the packaging of MEMS.
>               I need to find some introduction to this field.
>
>               So is there any fundamental reference books (or
>               handbooks) on the packaging of MEMS ,especially
>               accelerometer?
>
>               Or if there are some overview on the packaging of
>               accelerometer, it also makes the good thing.
>
>               Can anyone help me, please?
>               Thank you very much!
>
>               Jiang
>               E-mail:yqjiang55@yahoo.com
>               Find the one for you at Yahoo! Personals
>               http://personals.yahoo.com
>               _______________________________________________
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>
>--__--__--
>
>Message: 2
>Cc: 
>To: Jack Kotovsky  
>Date: Fri, 16 Nov 2001 18:42:02 +0100
>Subject: Re: [mems-talk] Deep RIE Wafer Mounting to Handle Question
>From: Erik Jung 
>
>You might try a material called "crystal bond" from Aremco
>(www.aremco.com) or any type of hot wax used for polishing
>applications. These materials typically melt around 1400C
>
>Please post your findings!
>MbR,
>Erik
> > Hello;
> >
> > I'm having the classic problem of masking resist failure during Deep
>RIE
> > etching (STS Etcher).  I have a 70um thick 4" Silicon substrate that
>must
> > be mounted on a handle (carrier) wafer prior to photolith and Deep
>RIE
> > etching.  I have experienced repeated failures with resist mounting
> > (gluing) techniques (presumably from masking resist loss due to
> > overheating) and am looking for a better mounting procedure or
>'glue'.
> > The wafer must be able to be released easily from the handle after
>etching
> > and can not tolerate temperatures over ~170C.
> >
> > The generic recipe I have used for resist mounting of the thin
>substrate
> > is to spin on ~1.6um resist on the handle and to bring the wafers in
> > contact before baking.  Aluminum foil is placed over the wafer
>sandwich
> > and a weight (2 pounds) is placed on the wafers.  The assembly is
>baked at
> > 100C for 1-3 hours.  I notice significant resist flow (observed
>after
> > failure) resulting in poor adhesion and likely poor cooling.
> >
> > Can you recommend a better glue or gluing technique to address the
>needs
> > of thin substrate mounting for Deep RIE etching?
> >
> > Thank you very much, Jack
> >
> >
> >     Jack Kotovsky                   (H) (530) 758-6278
> > _______________________________________________
> > mems-talk@memsnet.org mailing list: to unsubscribe or change your
>list
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>http://fab.mems-exchange.org/mailman/listinfo/mems-talk
> > Hosted by the MEMS Exchange, providers of MEMS processing services.
> > Visit us at http://www.mems-exchange.org/
> >
> >
>BITTE NICHT AN DIESE MAILADRESSE ANTWORTEN!
>Erik Jung FhG-IZM
>
>
>--__--__--
>
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>End of mems-talk Digest


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