On Tue, 11 Jun 1996, Jack W. Judy wrote: > ] Dear MEMS, > ] I am currently having problems electroplating small nickel > ] features (typically a few microns) through thick photoresist. I am unable > ] to get the electroplating solution (Nickel sulphate based) into all the > ] resist openings due to the high aspect ratios and small > ] dimensions. I would be grateful if anyone could suggest a suitable > ] wetting agent to overcome this problem. > ] > ] Cheers, > ] Mike Young. > > Mike, > > Perhaps a pinch of the surfactant "Sodium Lauryl Sulfate" will do the trick. > You will often find it listed on the back of shampoo bottles. > > If you add too much the bath will form a foamy head like a beer. > > > -Jack For MEMs-CMOS integration considerations, will this "Sodium Lauryl Sulfate" produce free sodium which could be harmful to the MOS gate oxide? _______________________________________________________________ Robert Antaki laboratoire LISA, physique du solide departement de genie physique, Ecole Polytechnique Courrier-E: antaki@lisa.polymtl.ca tel: (514) 340-3716 fax: (514) 340-3706 lab: (514) 340-3717