My experience is ~3 hours to etch 5 microns in Pyrex using 6:1 Buffered Oxide
Etch.  The etch rate of thermal SiO2 is 800-1000 Angstroms/min.

>>> Paolo Bondavalli  12/04/01 12:31AM >>>
Dear MEMS experts,
I'm looking for details about the selectivity factor between the SiO2
and Pyrex when they are chemically etched.
Could you give me any references?
Thanks a lot

**********************************************
Dr. Paolo Bondavalli
R&D Engineer
LABCOM - Laboratoire Interconnexions Optiques et MEMS
THALES (ex THOMSON-CSF) CORPORATE RESEARCH CENTER
Domaine de Corbeville,
Route Departementale 128
F91404 ORSAY
(FRANCE)
Tel : 01 69 33 08 63
Fax : 01 69 33 08 62
Email : Paolo.Bondavalli@thalesgroup.com
**********************************************
_______________________________________________
mems-talk@memsnet.org mailing list: to unsubscribe or change your list
options, visit http://fab.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.mems-exchange.org/