SU-8 cannot withstand KOH. It is chemically attacked
by KOH and I am afraid nothing can change that.
You may use TMAH instead, which does not attack SU-8.
But even then adhesion is a challenge.
Please contact me if you need more information.

Greetings,
        Frank Berauer
        Senior R&D Engineer
        Hewlett-Packard Singapore


-----Original Message-----
From: Tao Xu [mailto:xutao1966@hotmail.com]
Sent: 5 December 2001 14:50
To: mems-talk@memsnet.org
Subject: [mems-talk] Question for SU-8 photoresist adhesion problem.


Hi,

    I met a question about SU-8 photoresist adhesion.
    I spun SU-8 on the SiO2/Si or Si3N4/Si substrate. After pattern the
SU-8, I put them into 30% KOH solution (80 degree C) to etch Si to form the
V-groove. However, SU-8 peeled off very quickly (just 1-2min) in the KOH
solution. The SU-8 is a part of my device and I want it to stay there after
KOH etching.
    Did anybody meet this problem and know how to solve it? Any suggestion
is high appreciation. Thanks in advance.

Regards,

Tao

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