Wafer bonding with temporary adhesives can be done with hot melt materials.

The most used years ago is apazion "black wax" sold in sticks or today there
are a number good adhesives called "Crystalbond" from a company in NewYork
State.  These all have various melting points.  the base wafer is placed on a
hot plate and the temperature adjusted to the melting point of the stick
adhesive. The surface of the base wafer is carefully covered with a thin
layer in a very liquid from.  Next your thin wafer is carefully applied to
the melted adhesive.  Using a large diameter dowel or wood turning and cover
at one end with thick felt you gently push on the top wafer in a very slight
circular motion to push out all the air bubbles.  This works good but it
takes some practice to do well. Sapphire wafers work best for the base wafer
as you can see if air bubbles are all out.  For large diameter wafer 100 mm
and larger the sapphire should have a series of very small drilled through.
When finished with photo work the adhesive is dissolved with solvent suitable
to the adhesive.  Caution! do several test trials first to get the technique
down,

Good Luck