Hi all, Is there a micromachining technique that can achieve a surface 45 degree-inclined with respect to the wafer surface? I'm not restricted to a specific material nor to a specific technology,but the 45-degrees should be achieved with high accuracy and thus i first considered wet etching in silicon but i failed to get the required angle by any of the known tricks. _________________________________________________________________ Get your FREE download of MSN Explorer at http://explorer.msn.com/intl.asp.