We typically use a SiO2 mask for anisotropic etching, but would like to develop a special purpose process that does not require heating the wafer to high temperatures to form oxide or nitrides. We etch with alkali hydroxides. Is there any photoresist or other low temperature material that will resist the hydroxide etch? best regards mark Mark W. Lund, PhD Director >> Soft X-ray Web page http://www.moxtek.com<< MOXTEK, Inc. ************************************************* Orem UT 84057 **"Soft x-rays in the 21st Century" conference ** 801-225-0930 ** 8-11 January 1997, Midway Utah ** FAX 801-221-1121 ** http://volta.byu.edu/xray/info.html ** lundm@xray.byu.edu ************************************************* "Isn't it enough that his likeness is on a dime, which, thanks to him is worth about two cents?" -- L.Rockwell