> > Dear colleagues, > > I am trying to isotropically etch glass wafers. I want to etch the mask > directly, but after etch in 1:1 BOE/HF, I found that the Cr was lift off > and etched away, and the lateral etch rate is much higher than vertical. > I don't understand why is that, maybe because the etching of Cr, but accord- > ing to CRC hand book, Cr should be able to stand for HF. Is there anyone did > the similar process? How can I get good isotropic etching of glass wafer? > Any suggestions and explanations are highly appreciated. Thanks a lot. > > Ingrid Y. Xu > Microfabrication and Application Lab > The University of Illinois at Chicago > TEL: (312)-413-7576 > > >