Connie,

At EVG we developed wafer bonding equipment for anodic bonding for Si/Py or
tripple stack. Check out our Web site for further information.
www.evgroup.com/applications/maincontent/content/mems/bonding.htm


Best regards,
Helge





                -----Original Message-----
                From:   Connie Kathleen Smith [mailto:cksmith@ruf.rice.edu]
                Sent:   Thursday, March 14, 2002 10:46 AM
                To:     mems-talk@memsnet.org
                Subject:        [mems-talk] Anodic Bonding of Si to Pyrex

                I need to bond Pyrex to both sides of a silicon wafer.  One
of the pieces
                of Pyrex is a full 4 inch diameter wafer (same as Si wafer)
with a
                thickness of 0.5 inches.  This is used as the base for a
flow cell etched
                into the wafer.  The other piece of Pyrex is a cover slip
for microscopy
                work so it is only 0.13 mm in thickness and a 50mm square.

                Has anyone ever anodically bonded pyrex to both sides?  All
the literature
                I read only describes the process for one side.

                Thank you,
                Connie Smith
                Department of Chemical Engineering
                Rice University
                6100 Main MS 362
                Houston, TX 77005
                Phone 713-348-3507
                Fax 713-348-5478
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