I am looking towards designing some MEMS devices (esp. torsional Micro-mirrors)
using Hybrid flip chip technology. My concern is that I am still thinking about
wheather I should use silicion on glass (Pyrex) or SI-to-SI bonding. Could you,
please, help with advices such that the drawbacks and the advantages of every
assembly, and how they could affect the properties of the components and their
integration density ?

Thank you everyone,

Sofiane Zairi



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