durusmail: mems-talk: Adhesion layers that can withstand a 3 hour HF release
Adhesion layers that can withstand a 3 hour HF release
2002-06-04
Adhesion layers that can withstand a 3 hour HF release
Bill Moffat
2002-06-04
Mehmet,
        Do not know if a vacuum vapor prime will withstand a 3 hour HF
process.  With aluminum we have found that a longer prime time is needed to
reach the lower number of Hydroxyl ions on a metalized wafer.  I would be
happy to run a matrix of prime time experiments for you if you have wafers to
spare.  Again let me reiterate, after a, vac vapor prime, the wafer is sealed
against attack of moisture and can withstand a very long up to 8 weeks
exposure to outside atmosphere.  Bill Moffat

-----Original Message-----
From: Mehmet R. Dokmeci [mailto:mehmetd@engin.umich.edu]
Sent: Monday, May 20, 2002 6:22 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] Adhesion layers that can withstand a 3 hour HF
release


        hello everyone:

I am working on a surface micromachined device with an exposed Au layer.
I was wondering if anyone knows of a low stress adhesion layer that
can withstand a long (3 hours+) HF release process.  Any papers and any
pointers are truly welcome,
Thanks,

                                                        -Mehmet
ps: MUMPS handbook uses Cr/Au however their soak times are much shorter.
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