Or you can try increasing the pressure. I think allot of people run into this problem because the mean free path length is longer then the relevant feature size. I've seen this problem come up when trying to post process vias that were laser cut in thick polyimide films. That is why atmospheric pressure ozone/plasma treatment systems work. Of course this assumes that you did not have any inorganic material sputtered onto the resist during O2-plasma treatment. Write back and let us know if this works. -Mike >>> smalek@samcointl.com 06/05/02 09:06AM >>> Hi Martin, You can use a UV-Ozone Cleaning process to remove the remaining 100-500 nm of polyimide. Please visit our Web site at http://www.samcointl.com/prod/UVO.html for our line of UV-Ozone Cleaners and contact me if you have any questions or would like to receive additional information. I look forward to helping you with your application. Shahram Martin HEDSTROM wrote: > Hi all, > > I have a problem with removal of polyimide residues under a nitride > membrane. The polyimide is removed in a pure O2-plasma since I am afraid > that any CF4 addition might hurt the nitride membrane. Apparently this > O2-plasma is not sufficient since I get small residues left with about > 100-500 nm thickness. > > Does anybody know about any dry etchant which can remove the last of the > polyimide without damaging the nitride membrane? > > Thanks in advance > > /Martin > _______________________________________________ > MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list > options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk > Hosted by the MEMS Exchange, providers of MEMS processing services. > Visit us at http://www.memsnet.org/ _______________________________________________ MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk Hosted by the MEMS Exchange, providers of MEMS processing services. Visit us at http://www.memsnet.org/