We have been using various ratios of the "standard" isotropic silicon etch (HF-HNO3-acetic acid) for deep etching of silicon. A haze often develops in apparently random places on the etched surface. The haze is due to a fine (~1 micron) texture that develops on the surface. Can anyone suggest a cause and/or remedy for this haze? Shifang Zhou Microelectronics Research Center New Jersey Institute of Technology