Hello, We develop packaging for MEMS devices, including component level vacuum packaging. Among other equipment, we have an HP4000 flipchip bonder for component placement, an SST Model 3150 high vacuum programmable furnace for vacuum sealing, and X-ray and acoustic microscopy for inspection. A more thorough description of our capabilities can be found at my web site, as listed below. Please contact me if we can be of assistance. Sincerely, Robert Dean Research Associate IV Center for Advanced Vehicle Electronics Auburn University 200 Broun Hall Auburn, AL 36849 Voice: 334-844-1838 Fax: 334-844-1898 Email: rdean@eng.auburn.edu Web: http://www.eng.auburn.edu/~rdean