durusmail: mems-talk: Looking for component level high vacuum(1mtorr to 5 mtorr) package sealing
Looking for component level high vacuum(1mtorr to 5 mtorr) package sealing
2002-10-02
Looking for component level high vacuum(1mtorr to 5 mtorr) package sealing
bille@npphotonics (Bill Eaton)
2002-10-03
>
> We need the foundry service for the component level vacuum package
> sealing for our MEMS devices, if you have the capability or know which
> company has this equipment to do so, please contact to me.
>

Amkor does hermetic packaging, but I don't know if they do vacuum. They tend
to work with extremely high volumes.

ASE Korea also does contract packaging, but again I don't know about vacuum.
They are probably high volume, too:
http://www.asekr.com/products/products.htm

Advanced Custom Sensors in Irvine, CA also does MEMS packaging. But they'll
work in lower volumes: http://www.acsensor.com/memspack.html

However you decide to do your packaging, you'll probably quickly discover
that it's not cheap. For MEMS devices, in excess of 70% of the sale price
typically is spent on packaging and test. Because integrated circuits are
often packaged in high volumes at costs of less than a penny a chip, there
is an expectation that the same economies can be realized by MEMS. However,
these sub-penny packages are not hermetic. Hermeticity and vacuum sealing
requirements drive the cost up substantially.

Bill Eaton, Ph.D.
Materials & Analysis Manager
NP Photonics
5706 Corsa Avenue, Suite 100
Westlake Village, CA  91362
Voice:  (818) 991-7044 x211
eFax:   (503) 214-5559
mailto://bill@npphotonics.com
www.parvenutech.com
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