In Au metalization process, the common adhesion layer Cr or Ti
tends to diffuse through the Au layer, especially at high
temperatures. A quick Google search shows that Pt or Pd has
been commonly used as the diffusion barrier layer. I wonder if
anyone has done any experiments or know any published papers
on this topic. I am looking for information on what the diffusion
barrier layers and their thicknesses have been tried and how
effective they are.

Any info will be appreciated.

Xing Yang