Chris, MCNC, through the MEMS TechNet, currently offers die and wire bonding of MUMPs chips that use a standard pad frame. In such a case as this, if your pads are not too small (>75 um) and they are placed around the periphery of the chip, we may be able to do this for you. In the past we have encountered situations where bond pads were on the order of 25 um or less and placed erratically around the chip making wire bonding extremely difficult. For this reason, we encourage people to use our pad frames whenever they plan to do the packaging at MCNC. If you have existing chips that require packaging we will be glad to discuss your needs. Dave Koester ********************************************************************* MCNC Electronic Technologies Division (919) 248-1493 (office) MEMS Technology Applications Center (919) 248-1455 (fax) P.O. Box 12889 3021 Cornwallis Rd. email Research Triangle Park, NC 27709-2889 http://mems.mcnc.org ********************************************************************** > > Greetings to the MEMS community, > I was wondering if anyone could recommend anyone who would offer wire > bonding (Al) as a service? I would have ~1cmX1cm die epoxied onto a IC socket. > I would be interested in wire bonding from Al pads to the IC pins. > > Thanks in advance, > > Chris Cormeau > InterScience, Inc. > 105 Jordan Rd. > Troy, NY, 12180 > Ph (518)283-7500 > Fx (518)283-7502 > > From Paul Franzon Tue Mar 05 17:30:40 1996 To: mems@isi.edu Subject: Re: Wire bonding From: "Paul Franzon" Date: Tue Mar 05 17:30:40 1996 Lines: 26 We've used MCNC with reasonable success (ie. the wire bonding was fine but the nitride was too thin for success.) David: Who should Chris contact, please? On Mar 4, 13:44, ccormeau@unix.cie.rpi.edu wrote: > Subject: Wire bonding > > Greetings to the MEMS community, > I was wondering if anyone could recommend anyone who would offer wire > bonding (Al) as a service? I would have ~1cmX1cm die epoxied onto a IC socket. > I would be interested in wire bonding from Al pads to the IC pins. > > Thanks in advance, > > Chris Cormeau > InterScience, Inc. > 105 Jordan Rd. > Troy, NY, 12180 > Ph (518)283-7500 > Fx (518)283-7502 > >-- End of excerpt from ccormeau@unix.cie.rpi.edu