Dear Dale,

In response to your questions about the processing of a 40um thick film of
Shipley SPR 5740 you may have reached the limits of the resist and could
possibly obtain an improvement in processability if you switched to another of
the thick resists available from Shipley, SPR 220...We, at Microchem, are seeing
a lot more enquiries into this resist for use in thick film applications but
will still require a double spin coat process....Should you need further
information please contact me at the email address given below....

Best regards,

Mark Shaw
Technical Sales & Applications Support
MicroChem Corp.

email: mshaw@microchem.com
url: www.microchem.com


I am interested in the latest and greatest processsing specs for Shipley
SJR-5740.
My typical process uses bake and exposure times for 40 microns total
thickness achieved in 2 spins using hot-bake cure, moisture re-absorb, and
exposure using a Suss MA6 with 1000W lamp.
I am interested in tweeking of this processes to achieve the best critical
tolerance defintion over 40 microns of thickness.

Dale Boehme
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AXSUN Technologies Inc.