Diamond cutting has several factors to consider.....most good, high quality
diamond cutting tools are made using electroless or electrolytic deposited
nickel and diamond slurry.  The corners of the diamond particles need to
stand above the nickel surface. During cutting the diamond edges need to be
re-fractured using an special stone.  Optimum cutting rates use a number of
factors.  The type of blade, taper and thickness are all important, but when
cutting, the diamond saw and work pieces needs to be cooled with water (the
water washes the debris from the low points).  Some of the best diamond
cutting technology is the slicing of silicon logs into wafers.
Rob

-----Original Message-----
From: mems-talk-bounces@memsnet.org
[mailto:mems-talk-bounces@memsnet.org]On Behalf Of kin@astri.org
Sent: Thursday, December 26, 2002 4:24 AM
To: mems-talk@memsnet.org
Cc: kin@astri.org
Subject: [mems-talk] Ceramic dicing blade


Dear friends,

    I am looking for a diamond sawing blade to dice up the
ceramic (alumina) wafers. I was using the disco diamond
blade before, but the result wasn't good (that blade dies
out very fast). Does anybody has the experience of dicing up
the ceramic wafers? Does anybody know which blade
manufacturers are good at ceramic dicing? My wafer sawing
machine is DISCO DAD341. I need a ceramic dicing blade which
is durable, accurate width tolorance and low chipping rate.
Thanks!

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