Stefan, I would think metal lift off which should be easy, repeatable and is capable of critical dimensions down to 0.1 micron with repeatable ease. No wet etching and no plasma etching which can be a pain when exotic gasses are required. if you need technical papers on lift off let me know. Bill Moffat -----Original Message----- From: Stefan Junge [mailto:sjunge@imsas.uni-bremen.de] Sent: Wednesday, January 15, 2003 7:01 AM To: mems-talk@memsnet.org Subject: [mems-talk] Dry strukturing of tungsten with PR as mask Dear all, i want to structure tungsten dry with PR as masking layer. Does anybody have experiences on etchrates, selectivities to SiO2. I thought about CH4, SF6 or Ar as gases. Regards, Stefan Junge -- Institute for Microsensors, -actuators and -systems (IMSAS) University of Bremen Stefan Junge (Ph.D student) Dep. 1: Physics/Electrical Engineering Otto-Hahn-Allee 28359 Bremen, Germany P.O. Box 330 440 28334 Bremen, Germany Tel.: +49-421-218-3586 Fax.: +49-421-218-4774 E-Mail: sjunge@imsas.uni-bremen.de Internet: www.imsas.uni-bremen.de _______________________________________________ MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk Hosted by the MEMS Exchange, providers of MEMS processing services. Visit us at http://www.memsnet.org/