Graham,

we can offer you our help as we have a lot of experience in all wafer
bonding processes.


Markus.


SUSS MicroTec
Business Field MEMS
Markus Gabriel
Schleissheimer Str. 90
85748 Garching
Germany
Fon     +49 89 32007 - 313
Fax     +49 89 32007 - 390
email   m.gabriel@suss.de
  http://www.suss.com/mems
------------------------------

-----Original Message-----
From: Graham Tomblin [  
mailto:gtomblin@sensotec.com]
Sent: Tuesday, February 04, 2003 11:38 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] GLASS FRIT BONDING PIEZORESISTIVE SEMICONDUCTOR
GAGES TOST ST


Does anyone know of a technique for bonding piezo-resistive strain gages =
to=20
stainless steel using glass frit?.
Types of glass, gages, wire bonds and process definition  would be a =
great help.
Regards
 Graham