durusmail
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mems-talk
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Bonding microchannels using SU-8 (Mikkel Fougt Hansen)
Adhesion layers that can withstand a 3 hour HF release (Bill Moffat)
Deep UV resists (Bill Moffat)
adhesive tape, glue (BRIAND Danick)
(100) Si deep etching (BERAUER,FRANK (HP-Singapore,ex7))
Removal of SU-8 (Jeff Zahn)
Looking for Dry Etching Systems (BobHendu@aol.com)
Removal of SU-8 (BobHendu@aol.com)
RE: Low stress LPCVD Nitride (Roger Shile)
Grad programs in MEMS (dinakar ramadurai)
(100) Si deep etching (Roger Shile)
MEMS through MOSIS (David Hong)
Re: problem of sidewall inhibition polymer (fzheng01@fiu.edu)
Grad programs in MEMS (Henry Yang)
ANNOUNCE: New MEMS-Business list (Andrew Kuchling)
Grad programs in MEMS (Faheem.Faheem@Colorado.EDU)
Grad programs in MEMS (Muralidhar K. Ghantasala)
Grad programs in MEMS (Mighty Platypus)
Titanium Spluttering (Oliver Powell)
ANNOUNCE: New MEMS-Business list (Franck Alexis Chollet (Asst Prof))
Grad programs in MEMS (Robert Okojie)
RE: SAMCO ICP Etching System, Model RIE-200iP (BERAUER,FRANK (HP-Singapore,ex7))