There are a couple of methods for reducing diameter- most common is laser cut down with edge rounding afterwards, which we can supply services for to you. There is also a method using a water jet that eliminates the need to do the edge rounding and is less stressful to the silicon. There are limitations and potential yields losses on the material using either method- but this really depends on the product and your specification. If you are planning to set up an operation to perform this in your facility a laser cut machine and an edge grinder would be the minimum that is needed- but you should also have etch and cleaning capability depending on your products. There are a few excess laser machines here in the US that were for sale and Edge grinders are available from a number of used equipment suppliers. You will likely find it is lower cost and less hassle to have a subcontractor perform that work than set up and maintain to equipment and process unless you are planning very high volumes. Please feel to contact me should you have any further questions or need further information on this. I have a local Germany contact as well. Best Regards, Ken Smith MIchaela Wullinger wrote: > hi all, > > is there any experiences with edge rouding or reducing the size of the > wafer? > I couldn't find the tool supplieres in the internet. > > > Best regards > Michaela Wullinger > > > _______________________________________________ > MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list > options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk > Hosted by the MEMS Exchange, providers of MEMS processing services. > Visit us at http://www.memsnet.org/ > -- Kmbh Associates 47 Rocket Circle Rancho Cordova, CA 95742 U S A 510-714-5055 Efax- 510 217 4421 or 561 658 6136 High Purity Float Zone and Specialty CZ Silicon for Power, IR and Mirror Optics, Optoelectronics, MEMS, SOI, and other Semiconductor applications. Service in SOI, Polishing SSP and DSP. Quartz, Glass, Pyrex and Borofloat Wafer Supply. Anodic Bonding. SOG, SOS.