> I have a 2µm thick layer of structured Aluminum on top of a Si-wafer. On > top of the Aluminum there is about 20-30nm of Titanium. > 1. Does anyone know how to (chemically?) remove the Titanium without > chaning the size of the Aluminium structures within less than 1µm? I don't know a chemistry that would do the job with proper selectivity. You may have to resort to Ar sputter etching / ion milling. > 2. I read that the conductivity of sputtered Aluminum can be enhanced by > tempering it. Does anyone know some figures how much the conductivity > changes? Ideally, from whatever value you start at to close to the bulk value. On modern semiconductor sputtering equipment, the as-deposited conductivity is already very close to bulk value, and will change only minimally during anneal, especially if deposited at >400deg.C. best regards, klaus -- Klaus Beschorner Metron Technology Europe, PVD (Eclipse) Process Manager Drosselweg 6,71120 Grafenau,Germany. Tel +49-7033-45683