Try an H2N2 descum at low power and low temperature before plating. I wouldn't try any acid dip processes, too dangerous around gold plating baths.. I would suggest trying a Matrix 105 system plumbed with H2N2 running at 100W 500mT 2 minutes 30 degrees C. - Justin -----Original Message----- From: Jukka.Viheriala@orc.tut.fi [mailto:Jukka.Viheriala@orc.tut.fi] Sent: Monday, January 03, 2005 4:28 AM To: mems-talk@memsnet.org Subject: [mems-talk] Plating Au on Ni. Hello, We are making process where we would like to plate gold features using thick PR-mold. Process we had in mind was following: 1. Evaporate Ni layer on GaAs-wafer. 2. Make thick PR-mold 3. Plate Au-trough mold on Ni 4. Remove PR 5. Etch Ni away using plated Au as a etch mask However we have problems with plating on Ni. It just is not plating anything. Should we try to make some pretreatment to Ni before try to plate Au? We have fresh and clean chemical with correct pH. Also plating Au on Au is working correctly. We are making our plating with Enthone Nuronex 309B plating solution (should be same stuff than Microfab Au150). Best regards, Jukka Viheriälä *********************************************** Jukka Viheriälä, Researcher Optoelectronics Research Centre Tampere University of Technology P.O. Box 692 FIN-333101 Tampere, Finland Tel.: +050 595 4147 Fax +358 3 3115 3400 Email: Jukka.Viheriala@orc.tut.fi _______________________________________________ MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk Hosted by the MEMS Exchange, providers of MEMS processing services. Visit us at http://www.memsnet.org/ **********************AMS CONFIDENTIAL AND PROPRIETARY INFORMATION***************************** This e-mail communication and any attachments are confidential and intended only for the use of the designated recipients named above.