Jukka,

Your Nuronex309B is probably Neutronex309 solution. If so, it is free of
cyanides. Your Ni oxide removal process can be achieved as suggested
previousely (my e-mail of Jan. 3, 05). Though, since the gold plating
solution pH is probably 9 or higher, you may do the actual rinsing with DI
water (after acid treatment) and then proceed with plating. This will
minimize the exposure of Ni to alkaline solution prior to electroplating.

Igor Kadija
www.fibrotools.com



----- Original Message -----
From: 
To: 
Sent: Monday, January 03, 2005 4:28 AM
Subject: [mems-talk] Plating Au on Ni.


Hello,

We are making process where we would like to plate gold features using
thick PR-mold. Process we had in mind was following:

1.    Evaporate Ni layer on GaAs-wafer.
2.    Make thick PR-mold
3.    Plate Au-trough mold on Ni
4.    Remove PR
5.    Etch Ni away using plated Au as a etch mask

However we have problems with plating on Ni. It just is not plating
anything. Should we try to make some pretreatment to Ni before try to plate
Au?

We have fresh and clean chemical with correct pH. Also plating Au on Au is
working correctly. We are making our plating with Enthone Nuronex 309B
plating solution (should be same stuff than Microfab Au150).

Best regards,
Jukka Viheriälä

***********************************************
Jukka Viheriälä, Researcher

Optoelectronics Research Centre
Tampere University of Technology
P.O. Box 692
FIN-333101 Tampere, Finland

Tel.: +050 595 4147
Fax  +358 3 3115 3400
Email: Jukka.Viheriala@orc.tut.fi



_______________________________________________
MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.memsnet.org/