If one side of the wafer has 1um PECVD nitride, nitride will prevent oxidation. Duan, do you mean get 0.4um oxide from the backside of the wafer? > Hi Duan, > > One sided films can do that to you. I'm assuming it was one sided. If > not, > was it a prime wafer to start with? > > Jeff > > -----Original Message----- > From: Duan [mailto:brokenspoon@gmail.com] > Sent: Thursday, October 06, 2005 7:51 AM > To: General MEMS discussion > Subject: [mems-talk] silicon nitride stress problems > > Hello all, > I have encountered some problems with the stress in thin films. > What I have done is that, I first got 1 micron PECVD silicon nitride on a > 6 > inch silicon wafer(400 um thick), then I put it in the oxidation furnace > at > 1100 degree to get 0.4 um oxide film. After this, the wafer was bent very > much, which was flat before oxidation. I don't know what the reason is. So > could someone kind enough to tell me why and possiblly tell me the way to > get rid of that. Any comments or literatures are quite appreciated > >