We did 400A Ti,500 A Pt,2000 A Au stack with sputtering, would that work
for you?

B.Kuyel
Nano-Master, Inc.

-----Original Message-----
From: mems-talk-bounces@memsnet.org
[mailto:mems-talk-bounces@memsnet.org] On Behalf Of sc wang
Sent: Tuesday, October 11, 2005 11:46 PM
To: mems-talk@memsnet.org
Subject: [mems-talk] Ni /Au adhesion

HI.

I have tried depositing Ni/Au(E-GUN) on bonding pad, but got poor
adhesion. (Ni=500A, Au=5000A)
So far, I tried Ni-Silide to improve the adhesion, but still can't work.
Is there any idea can improve Ni/Au adhesion?