Thin (~20nm) Cr or Ti film will be helpful. Also, plasma clean the substrate before your deposition. Good luck, Hongjun ------------------------------------- Hongjun Zeng, PhD MEMS/Nano Scientist Nanotechnology Core Facility (NCF) University of Illinois at Chicago -----Original Message----- From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org] On Behalf Of sc wang Sent: Tuesday, October 11, 2005 11:46 PM To: mems-talk@memsnet.org Subject: [mems-talk] Ni /Au adhesion HI. I have tried depositing Ni/Au(E-GUN) on bonding pad, but got poor adhesion. (Ni=500A, Au=5000A) So far, I tried Ni-Silide to improve the adhesion, but still can't work. Is there any idea can improve Ni/Au adhesion?