You can use PI2737 from HD Microsystems. We spin coat this @1600 rpm for
60 seconds followed by soft and hard bakes @ 75 C and 100 C both for
three minutes on the hot plates. Then we expose and develop it. We cure
it @ 300 C for four hours to get a thickness of about 2.1-2.3 um. At the
end of the process we take off the PI2737 by means of oxygen plasma
(ashing in oxygen plasma for about nine hours). This way we create
bridge like suspended structures. Hope this will help you.

Mukti M Rana
PhD. Student in Electrical Engineering
The University of Texas at Arlington



-----Original Message-----
From: mems-talk-bounces@memsnet.org
[mailto:mems-talk-bounces@memsnet.org] On Behalf Of Giuliano Gregori
Sent: Monday, November 07, 2005 1:08 PM
To: General MEMS discussion
Subject: [mems-talk] HD-8820 Polyimide

Hi all,
I'd like to use polyimide as sacrificial layer for the fabrication of an

air-bridge.
I'll have to spin it on a SiO2 surface; on part of the top I'll have to
deposit gold and SiO2 again.
I was thinking to use HD-8820 polyimide and I wonder whether this is a
good solution.
Has anybody already used something similar ?   Suggestions ???