Nik, Try to use O2 plasma after developing to confirm the complete removal of photoresist at the bottom. Uniformity of copper also depends upon the electrode. I believe taht using rotaty electrode will help in improving the uniformity of copper. Pradeep 1/17/06, Nik Deewrote: > Hi guys. I am trying to copper plate some gold features that are > surrounded by > SU-8. The problem I get is that the plating takes place only in a few of > those > features. I want to believe that there is some residue left on top of the > gold. > I ve also tried longer development of the SU-8 to make sure that there is > none > left on the gold traces but still I get the same problem when I copper > plate. > Any ideas??