Hello All I am working on fabrication of MEMS acoustic sensor. we bond a glass wafer with hole by anodic bonding on backside of chip to compensate the acoustic pressure. Can anybody has idea to fabricate the chip in such a way so that there is no need to do hole in glass wafer. Thanks Aarti Aarti Arora Project Assistant & research Scholar, MEMS & MicroSensors group, Central Electronics Engineering Research Institute, Pilani, INDIA