Aarti,
If your backside hole is for pressure compensation you can etch channels
either in the glass or on the back of the chip. You have to make large
enough channels or multiple channels to allow for dynamic range

Shay

Mizur Technology
www.mizur.com

-----Original Message-----
From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org]
On Behalf Of Aarti Ji
Sent: Thursday, March 16, 2006 9:10 AM
To: mems-talk@memsnet.org; mems-talk-request@memsnet.org
Subject: [mems-talk] idea to avoid hole in glass wafer bonded with
acousticsensor

Hello All
I am working on fabrication of MEMS acoustic sensor.
 we bond a glass wafer with hole by anodic bonding on backside of chip to
compensate the acoustic pressure. Can anybody has idea to fabricate the chip
in such a way so that there is no need to do hole in glass wafer.
Thanks
  Aarti