Hi Kevin,

for wet etching of Ag we use a 45% solution of Fe(NO3)3 in water. The
etch rate is quite high
- approx 3...5 min for 2 microns @ room temp.
hopefully this will help...

Best regards

Peter

--
Vienna University of Technology
Institute of Sensor and Actuator Systems
Gusshausstrasse 27-29/366
A-1040 Vienna
Austria

Tel. +43-1-58801-36643
Fax  +43-1-58801-36699




Kevin wrote:

>Hi,
>
>I'm trying to patter a very thin silver film using photolithography. I am
>having a few problems.
>
>1. After developing S1811 in MF 321 (contains TMAH), I cannot seem to etch
>silver in HNO3. Does TMAH react with Ag?
>
>Can I just use TMAH to etch silver?
>
>2. Is there a better way to etch silver than using HNO3? I've tried
>I2:KI:H2O but I fear that this may be reacting with my PMMA layer which sits
>between my silver layer and substrate.