Mike, I have experienced problems with freely suspended structures during DRIE, the passivation/resist often fails resulting in etching away of structures. Structures suspended on long thin springs are particularly susceptible. I would also be interested in any publications about this effect. Here's one reference I have found, which describes a heating effect, but not an electric field effect: Sensors & Actuators A 97-98 p. 691 (2002) Regards, Martin. > -----Original Message----- > From: Michael D Martin [mailto:michael.martin@louisville.edu] > Sent: 23 June 2006 16:33 > To: mems-talk@memsnet.org > Subject: Re: [mems-talk] DRIE - Heating Effects & influence on CMOS > > Yes, the influence of freely suspended structures in the DRIE (and in > all plasmas) has a significant affect on the etch geometry. First, the > suspended structures will heat more redilly in the plasma. Second, the > local electric field geometry is distorted. The results of > these affects > are geometry and material dependant but frequently result in > sputtering/excess etching around the high field regions. > Essentially you > loose selectivity to your masking layer.