Hello

I am trying to plate gold through a via hole of 100 um in diameter and 125um
deep. I am having problems with gold plating solution getting trapped in the
hole, though I am plating at a very slow rate. I wanted to know is there a way
to overcome this or is there any other method to make a through hole contact.
There is layer of Ti and a layer of sputtered gold in the via to which I want to
make a contact.

Thanks,
Deepa