Deepa, You might try ultrasonic agitation during the plating cycle. Gary

Gary Hillman
Service Support Specialties, Inc.
9 Mars Court
PO Box 365
Montville, NJ 07045
973-263-0640
973-263-8888.



-----Original Message-----
From:   deepa sree [SMTP:dapisree@yahoo.co.in]
Sent:   Wednesday, October 04, 2006 7:29 AM
To:     mems-talk@memsnet.org
Subject:        [mems-talk] Gold plating through a via hole

Hello

I am trying to plate gold through a via hole of 100 um in diameter and
125um deep. I am having problems with gold plating solution getting trapped
in the hole, though I am plating at a very slow rate. I wanted to know is
there a way to overcome this or is there any other method to make a through
hole contact. There is layer of Ti and a layer of sputtered gold in the via
to which I want to make a contact.