Hello All, I am planning to deposit Nickel Nanodots & Gold microwire on same wafer. Nickel nanodots will be deposited using PAA(Porous anodized alumina) technique with nickel electroplating & I am planning to do gold deposition using sputtering technique. However I am not sure which one to go first & which one i need to deposit at the last. If any of you people have any information, please let me know.. Thanks Regards, Madhav