Aluminum is usually sputter with a dc magnetron. Gary Gary Hillman Service Support Specialties, Inc. 9 Mars Court PO Box 365 Montville, NJ 07045 973-263-0640 973-263-8888. -----Original Message----- From: Qiao Dayong [SMTP:dyqiao@nwpu.edu.cn] Sent: Monday, October 16, 2006 9:58 AM To: mems-talk@memsnet.org Subject: [mems-talk] Problem about Al sputtering Dear MEMS community, I am using a RF magnetron sputtering system to deposit Al and Cu film on silicon substrate. The recipe is: Ar flow rate: 80 sccm RF power: 150 Watt Base pressure:3e-3Pa Pocess pressure: 0.8Pa The Cu can be successfully deposited, but there is no Al deposited on the silicon substrate after 30 min sputtering. Would anyone give me an reasonable explanation or any suggestion or some tricks about that? Thanks in advance.