Hi I am coating SU8 2025 on Si wafer with a target depth of 30um. I prebake in a hot plate using the ramp up procedure, i.e. 65C for 2 min and 95C for 4 min. My exposure time is around 100sec and I post-bake the wafer after exposure in an 80C oven for 90 min. Because I want to do PDMS replica molding with SU8 masters, I also hard bake the SU8 wafers for 1 hour in 100C after development for better adhesion of resist. When I lift-off the PDMS, I see that my thinnest features, ~10um size features peel off along with the PDMS. Thicker features stay intact. Please advice if you may have any clue to this problem. regards -Abhishek Jain Arizona State University Tempe, AZ 85281