Hello Kris,

We did  also electroplating of Au (sulphite based)on Ni, but we observed a
very bad adhesion of Au onto the Ni seedlayer.
Did you observed this also or do you have a special pre-treatment to
overcome this?

Regards,
Peter Kuijpers
MiPlaza
DTS/TFF
High Tech Campus 04
Room: WAGp5-11
5656 AE Eindhoven
The Netherlands

Phone.:  (+31 40 27) 98904 (mobex)
mobile:(+31) 06-12507027
fax.:     [+31 40 27) 44769
mailto:p.e.m.kuijpers@philips.com


kris  writes:
Subject [mems-talk] Au electroplating Classification

Hello All,

IS there a method to produce stress free Au
electroplated structures??

I am using sulphite bath and 1.5mA/cm^2 of the current
density. Ni is used as the seed layer.