Hello Dave,

Another question about wafer plating:
We did install ENIG (Eletroless Nickel/Immersion Gold, Rohm and Haas
chemicals).
After Nickel plating we observed outplating of our Ni bath? We do have N2
bubbling in our bath for extra agitation.
Is there another simple solution to avoid this outplating?

Thanks in advance,
Peter Kuijpers
MiPlaza
DTS/TFF
High Tech Campus 04
Room: WAGp5-11
5656 AE Eindhoven
The Netherlands

Phone.:  (+31 40 27) 98904 (mobex)
mobile:(+31) 06-12507027
fax.:     [+31 40 27) 44769
mailto:p.e.m.kuijpers@philips.com


"David Roberts"  writes:
Subject RE: [mems-talk] Au electroplating Classification

Hi Peter,
Cathodic activation at 20mA/cm2 in 10%sulfuric. Keep wet. Plate gold.