Hello.

I'm semiconductor Engineer in South Korea.

Ti or Ta is used for adhesion between SiO2 and Pt.
So In my option Ta or Ti needs to deposit if Pt layer thickness increase.
(about Ti 200~300A at Pt 1500A~2000A)
If Pt layer thickness thin (without Ta/Ti layer), you have to clean the
substrate before Pt deposition process. (to remove the particle, organic &
to increase Roughness -> O2 plasma treatment is good method within 1 min)
And Pt material is very strong at O2 plasma.

Thanks.

-----Original Message-----
From: Steven Yang [mailto:steven030505@gmail.com]
Sent: Saturday, February 16, 2008 6:47 PM
To: mems-talk
Subject: [mems-talk] Is it possible to deposit Pt directly on
Si/SiO2(PECVD) substrate?

Hi, all

Not sure the Pt (sputtering) will stick firmly on the substrate or
not? as normally Ti/Pt is used for the electrode deposit. But I am
going to try Pt directly on Si substrate with PECVD SiO2 (1 or 2 um)
due to machine limitation.


and if possible, will the Pt electrode firm enought to go through some
processes like Piranha, O2 plasma?

Thank you very much!

Steven