Hi All, I am looking for a something in the way of a sealant to protect Al bond pads on a silicon wafer from being attacked in NaOH/H2O2 etch. The sealant should be low/non-outgassing, low (<80degC) cure temp, low viscosity and easily and completely removable with domestic chemicals (acetone, tetrachloroethylene etc). I'll be grateful for any recommendations, even if they don't meet all the specs above. I am currently using Dow Corning DC282, but it is not wholly resistant to the NaOH. Many Thanks, Darren. SELEX Sensors and Airborne Systems Limited