There is an adhesion promoter for Parylene - check with manufacturer. It will help with adhesion of the film to the wafer. The film also has to be relatively thin ( <2um) and you've got to have a way to remove it after the etch. Coating over film of SiO2 sounds like a good idea. Parylene does tend to delaminate during long etch cycles. -----Original Message----- From: Dirk.DeBruyker@parc.com [mailto:Dirk.DeBruyker@parc.com] Sent: Wednesday, October 08, 2008 11:55 AM To: mems-talk@memsnet.org Subject: Re: [mems-talk] Parylene mask for KOH etch I tried this. You should do some silane chemistry on the SiO2 surface to promote parylene adhesion (see e.g. http://engineering.tufts.edu/microfab/index_files/docs/Parylene.pdf). Even then, it doesn't work too well, the parylene tended to delaminate during long etch cycles.