Hello, In here we do have a Cup Plater for Cu plating (Rohm&Haas chemicals). The most important issues for a good uniformity are: - flow - current density - wafer lay-out - temp. If everything is well controlled we obtain an uniformity better than 5% (over a 6" wafer) with app. 15 µm Cu thickness. Peter Kuijpers MiPlaza Technology Laboratories High Tech Campus 04 Room: WAGp5-11 5656 AE Eindhoven The Netherlands Phone.: (+31 40 27) 43667 mobile:(+31) 06-12507027 fax.: [+31 40 27) 44769 mailto:p.e.m.kuijpers@philips.com ________________________________________ Van: mems-talk-bounces@memsnet.org [mems-talk-bounces@memsnet.org] namens Denis Petrov [dazeuhl@googlemail.com] Verzonden: dinsdag 18 november 2008 12:42 Aan: General MEMS discussion Onderwerp: [mems-talk] Cu electroplating uniformity problem Hello dear MEMS-Talk members! We are trying to electroplate 20-um thick copper over patterned 4-inch wafers. The problem is the uniformity of the Cu layer. If it is approx. 20 um in the middle of the wafer then we have something like 25 um at the edges. I found out that there is a device called an IBM Paddle Cell. Does anybody know anything about it? Is it of help in this case? Is there any other practical solution. We tried the rotating cathode method and we tried to agitate the solution with the rotating paddle. Did not help.