have you consider the notching as the root cause of that "distorsion",
could you send a picture?


Hope this helps,

jordi


On Sat, Jan 17, 2009 at 4:08 AM, Jie Zou  wrote:
> Hi, so the stress was so strong that it overcome the adhesion force between
> the BOX and the Device layer? It sounds very strange to me. You mean it
> peeled off the BOX or it slided on the BOX? Both look impossible. And the
> DRIE usually comes with a cryogenic back cooling, thus I don't think it
> brings too much heating issues.
> how wide is your beams? I have some 2~3 um legs (after 1um undercutting from
> one side) and device layer 5um thick, but never saw the distortion
> happened.
>
> Just one thought. Did you mean the beams were not straight? Microloading
> would cause faster etching rate in the region with larger intervals between
> objects than the crowd region. So the beam could look like distorted to the
> less crowd region.
>
> Jie
>